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A case study on process monitoring for surface features
Author(s) -
Taam Winson
Publication year - 1998
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/(sici)1099-1638(199807/08)14:4<219::aid-qre193>3.0.co;2-5
Subject(s) - wafer , measure (data warehouse) , process (computing) , surface (topology) , wafer fabrication , sample (material) , fabrication , integrated circuit , computer science , reliability engineering , materials science , engineering drawing , mechanical engineering , engineering , data mining , mathematics , optoelectronics , physics , geometry , medicine , thermodynamics , alternative medicine , pathology , operating system
In the fabrication of integrated circuits it is a common practice to measure the oxide thickness at many locations on a wafer and to summarize these measurements in terms of the average thickness and thickness uniformity. These summary measures, however, may not be as informative as certain features of the thickness surface in terms of the process objectives. Alternative surface features are considered and process monitoring techniques are illustrated using a sample of wafers. © 1998 John Wiley & Sons, Ltd.