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Evaluation on a two‐day time scale of high‐reliability electronic assemblies by in‐situ electrical and opto‐mechanical test techniques
Author(s) -
Gregoris G.,
Bouton F.,
De Keukeleire C.,
Siliprandi P.,
Baio F.,
De Schepper L.,
De Ceuninck W.,
Tielemans L.,
Ahrens T.,
Krumm M.
Publication year - 1996
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/(sici)1099-1638(199607)12:4<247::aid-qre22>3.0.co;2-o
Subject(s) - reliability (semiconductor) , quality assurance , reliability engineering , test (biology) , in situ , scale (ratio) , quality (philosophy) , computer science , engineering , operations management , geology , chemistry , paleontology , power (physics) , physics , external quality assessment , philosophy , organic chemistry , epistemology , quantum mechanics
We present the results of SHORTEST, a BRITE EURAM II project for the introduction in industry of an advanced approach to the reliability evaluation of electronic assemblies. The achievements so far are the development and validation of seven in ‐ situ test techniques. Five of the test techniques demonstrate the capability of detecting failure mechanisms at 48 hours with moderate stress conditions, and half of the in ‐ situ test results obtained at 48 hours on 10 subtechnologies correlate with conventional tests. All correlation results are presented. The application of the method for quality assurance and building‐in reliability is discussed. The final aim of SHORTEST is to look for the exploitation of the developed in ‐ situ techniques. The marketing study that will define the industrial needs of European companies is presented. In parallel, the insertion in the CECC specification of recommendations based on the SHORTEST principle is foreseen.