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Conductive polymers for microelectronic packaging: chip bonding to polymer films
Author(s) -
Küchenmeister Frank,
Böttcher Matthias,
Meusel Ekkehard,
Meier Dieter
Publication year - 1998
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/(sici)1099-1581(1998100)9:10/11<806::aid-pat824>3.0.co;2-8
Subject(s) - materials science , microelectronics , polymer , ohmic contact , electroplating , auger electron spectroscopy , conductive polymer , electrical conductor , optoelectronics , composite material , nanotechnology , layer (electronics) , physics , nuclear physics
A novel flipchip‐like microelectronic packaging technology for bonding integrated circuits to polymer foils using laser micromachining technique and a wet chemical metallization process of conductive polymers has been developed. This paper will focus on the deposition of polypyrrole onto the aluminum surface and the characterization of the thin film using scanning electron microscopy, auger electron spectroscopy and X‐ray photoelectron spectroscopy. The conductive polymer is metallized by copper electroplating for connecting the integrated circuit to the polyimide foil. Electrical measurements were performed on patterned substrates with a layer system consisting of polypyrrole/copper/tin–lead deposited on aluminum bond pads. The characteristic current/voltage curve shows an ohmic contact behavior which is of fundamental importance for the development of chip bonding technology using conductive polymers. © 1998 John Wiley & Sons, Ltd.