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Electrical conductivity change of polyaniline–dodecyl benzene sulfonic acid complex with temperature
Author(s) -
Kim Seok,
Ko Jang Myoun,
Chung In Jae
Publication year - 1996
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/(sici)1099-1581(199607)7:7<599::aid-pat549>3.0.co;2-o
Subject(s) - dodecylbenzene , polyaniline , sulfonic acid , materials science , dopant , doping , thermal conductivity , conductivity , fourier transform infrared spectroscopy , chemical engineering , thermal decomposition , analytical chemistry (journal) , electrical resistivity and conductivity , polymer chemistry , chemistry , composite material , organic chemistry , polymer , polymerization , optoelectronics , engineering , metallurgy , sulfonate , sodium , electrical engineering
Polyaniline–dodecylbenzene sulfonic acid (PAn–DBSA) complex was thermally treated and its conductivity and structure change were investigated. The conductivity increased linearly from 1.1 × 10 −4 to 3.0 × 10 −1 S/cm on thermal heating until 140°C, but decayed above 200°C. The increase was caused by an additional thermal doping resulting from an increasing mobility of undoped dopants. After the thermal doping, the formation of the layered structure of PAn–DBSA is made. The decrease was caused by the thermal decomposition of dopants. The conductivity changes at a high temperature was strongly dependent on the nature of the dopant. The results were confirmed by means of X‐ray patterns and Fourier transform infrared spectra obtained in the heating and cooling processes of polyaniline.