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Polymer alloy adhesive film made up of epoxy resin and aromatic polyester
Author(s) -
Takahashi Atsushi,
Horiuchi Takeshi,
Nomoto Masahiro,
Nanaumi Ken,
Yamamoto Kazunori
Publication year - 1996
Publication title -
polymers for advanced technologies
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.61
H-Index - 90
eISSN - 1099-1581
pISSN - 1042-7147
DOI - 10.1002/(sici)1099-1581(199604)7:4<329::aid-pat519>3.0.co;2-l
Subject(s) - materials science , adhesive , epoxy , composite material , polyester , alloy , polymer , flatness (cosmology) , printed circuit board , composite epoxy material , layer (electronics) , physics , cosmology , quantum mechanics , computer science , operating system
Printed wiring boards (PWBs) with high wiring density such as thin multilayer PWBs and flexible PWBs requiring bonding sheets with superior thermal and adhesive properties, and must have a flat board surface. To meet these requirements, a polymer alloy adhesive film made up of epoxy resins and aromatic polyester has been developed. The crosslinking reaction between the components was utilized to improve thermal properties. The polymer alloy adhesive film demonstrates good heat resistance and adhesiveness. It features a low processing pressure of 2 MPa at 170°C and gives the board surface greater flatness, which is better for the fine wiring of PWBs.