Premium
Component migration from adhesives used in paper and paperboard packaging for foodstuffs
Author(s) -
Gruner Anita,
Piringer Otto
Publication year - 1999
Publication title -
packaging technology and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.365
H-Index - 50
eISSN - 1099-1522
pISSN - 0894-3214
DOI - 10.1002/(sici)1099-1522(199901/02)12:1<19::aid-pts445>3.0.co;2-3
Subject(s) - paperboard , adhesive , carton , component (thermodynamics) , plastic packaging , corrugated fiberboard , computer science , manufacturing engineering , engineering , materials science , mechanical engineering , composite material , physics , layer (electronics) , thermodynamics
This paper presents the first results of research on the migration of adhesive components in the paper and paperboard packaging sector. It examines components that can migrate from a variety of commonly used adhesives in the framework of a ‘worst case’ scenario in respect of the contents. The report also explains the methodology used to analyse extraction and migration and the model used for calculating the transfers. Copyright © 1999 John Wiley & Sons, Ltd.