Open AccessReactive adsorption of aminosilane onto the glycidyl methacrylate graft‐copolymerized poly(tetrafluoroethylene) film surface for adhesion enhancement with evaporated copper
Author(s) -
Liu Y. X.,
Kang E. T.,
Neoh K.G.,
Tan K. L.
Publication year - 2000
Publication title -
journal of polymer science part a: polymer chemistry
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.768
H-Index - 152
eISSN - 1099-0518
pISSN - 0887-624X
DOI - 10.1002/(sici)1099-0518(20000101)38:1<80::aid-pola11>3.0.co;2-a
Subject(s) - tetrafluoroethylene , glycidyl methacrylate , silane , materials science , adsorption , x ray photoelectron spectroscopy , polymer chemistry , contact angle , surface modification , copolymer , chemical engineering , adhesion , protein adsorption , methacrylate , polytetrafluoroethylene , acrylic acid , adhesive , composite material , chemistry , polymer , layer (electronics) , organic chemistry , engineering
Surface modification of argon‐plasma‐pretreated poly(tetrafluoroethylene) (PTFE) film via UV‐induced graft copolymerization with glycidyl methacrylate (GMA) was carried out first. Reactive adsorption of γ‐aminopropyltriethoxysilane (APS) onto the GMA graft‐copolymerized PTFE (GMA‐ g ‐PTFE) film surface was performed by the simple immersion of the film in the APS solution. The adsorption process was studied as a function of the APS concentration, the immersion time of the graft‐modified PTFE film in the APS solution, and the washing protocol. The chemical composition and morphology of the silane‐modified surfaces were characterized by X‐ray photoelectron spectroscopy and atomic force microscopy, respectively. The performance of the silane‐modified PTFE surface in adhesion promotion was investigated. The T‐peel adhesion strength of the evaporated Cu on the PTFE film with the reactively adsorbed organosilane increased significantly to about 12.5 N/cm. This adhesion strength was more than twice that of the assembly involving evaporated Cu on the GMA‐ g ‐PTFE film and about 10 times that of the assembly involving evaporated Cu on the Ar‐plasma‐treated PTFE film. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 80–89, 2000