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Thermal characteristics of MMIC package
Author(s) -
Cheng Feng,
Yang Quanrang
Publication year - 2000
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/(sici)1098-2760(20000620)25:6<368::aid-mop2>3.0.co;2-0
Subject(s) - monolithic microwave integrated circuit , microwave , electrical engineering , power (physics) , thermal , integrated circuit , electronic circuit , engineering , electronic engineering , materials science , telecommunications , thermodynamics , physics , amplifier , cmos
An analysis of the thermal characteristics of the MMIC package is presented in this paper by solving the heat transport equation using the heat balance method. According to the result, which includes the temperature variation, the temperature distribution, and the maximum temperature in the package, the maximum power of the packaged devices can be limited in order to protect the packaged circuits from a high temperature. © 2000 John Wiley & Sons, Inc. Microwave Opt Technol Lett 25: 368–371, 2000.