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A full‐wave analysis of submicronic circuits in the microwave frequency range to estimate the input shape influence over VLSI interconnect performances
Author(s) -
Servel G.,
Huret F.,
Paleczny E.,
Kennis P.,
Deschacht D.
Publication year - 1999
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/(sici)1098-2760(19991220)23:6<376::aid-mop18>3.0.co;2-c
Subject(s) - interconnection , very large scale integration , electronic engineering , microwave , network analysis , electronic circuit , engineering , electrical engineering , computer science , telecommunications
In this letter, we present an efficient and accurate modeling and simulation technique for frequency‐dependent transmission lines to determine interconnection characteristics. Based on a tangential vector finite‐element method, this full‐wave approach naturally incorporates inductive effects. In order to illustrate the potentiality of this approach, this full‐wave analysis is used to estimate the input shape influence over VLSI interconnect performances. ©1999 John Wiley & Sons, Inc. Microwave Opt Technol Lett 23: 376–380, 1999.