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Microwave power distribution in a multichip module radiative interconnection system
Author(s) -
Seager R. D.
Publication year - 1998
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/(sici)1098-2760(19980620)18:3<196::aid-mop10>3.0.co;2-2
Subject(s) - microwave , interconnection , antenna (radio) , electrical engineering , power (physics) , engineering , electronic engineering , microwave transmission , broadband , parabolic antenna , telecommunications , physics , quantum mechanics
A three‐dimensional model to calculate microwave power distribution in a radiative microwave interconnection system is described. The effect of a receiver antenna on the power available over the floor of a multichip module is noted. The requirement for a low‐gain, and hence relatively small, antenna is shown. © 1998 John Wiley & Sons, Inc. Microwave Opt Technol Lett 18: 196–200, 1998.