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Analysis of complex electronic packages with the use of using the FDTD/touchstone hybrid technique
Author(s) -
Chen Yinchao,
Harms Paul,
Mittra Raj,
Beyene Wendemagegnehu
Publication year - 1996
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/(sici)1098-2760(19960820)12:6<313::aid-mop3>3.0.co;2-i
Subject(s) - finite difference time domain method , electronic engineering , computer science , software package , electronic circuit simulation , field (mathematics) , software , integrated circuit packaging , electronic circuit , digital electronics , electrical engineering , integrated circuit , engineering , mathematics , physics , quantum mechanics , pure mathematics , programming language
The electromagnetic field behavior within electronic packages used for high‐speed digital circuit applications often cannot be accurately modeled with the use of a quasi‐static approximation. A frequency‐dependent analysis is sometimes needed for accurate analysis and simulation of the package behavior. In this article we employ the finite‐difference‐time‐domain (FDTD) approach, in conjunction with commercially available software called TOUCHSTONE, to model a generic 24‐pin silicon on plastic (SOP). The physical model for the package includes many details, such as the plastic encasement, bonding pads, and wires. The equivalent circuit of the package is validated by comparing its response to the one obtained with the FDTD algorithm. It is hoped that the technique presented herein will lead to more accurate circuit simulations of complex packaging configurations than has been possible with the use of quasi‐static analyses. © 1996 John Wiley & Sons, Inc.