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Novel low melting point alloy‐loaded polymer composite. II. Resistivity–temperature behavior
Author(s) -
Zhang Xiangwu,
Pan Yi,
Shen Lie,
Yi Xiaosu
Publication year - 2000
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(20000725)77:4<756::aid-app7>3.0.co;2-y
Subject(s) - alloy , materials science , electrical resistivity and conductivity , composite material , melting point , composite number , temperature coefficient , polymer , viscosity , dispersion (optics) , physics , optics , electrical engineering , engineering
The effect of temperature on the resistivity of Sn–Pb alloy‐loaded PS composites was studied. The composites have distinctive positive temperature coefficient (PTC) effects with high PTC intensity, abrupt PTC transition, etc. According to SEM and EDAX analyses, the morphology of the alloy particles in the composites remained unchanged as the temperature reached the melting point of the alloy, while the alloy dispersion changed. The viscosity of the composites decreased sharply when the alloy melted. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 756–763, 2000