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Surface modification of polytetrafluoroethylene with tetraethoxysilane by using remote argon/dinitrogen oxide microwave plasma
Author(s) -
Chun Tae Il,
Choi Suk Chul,
Täschner Christine,
Leonhardt Albrecht,
Kaufmann Robert,
Rehwinkel Carsten,
Rossbach Volker
Publication year - 2000
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(20000523)76:8<1207::aid-app1>3.0.co;2-j
Subject(s) - polytetrafluoroethylene , attenuated total reflection , x ray photoelectron spectroscopy , contact angle , argon , oxide , materials science , scanning electron microscope , surface energy , fourier transform infrared spectroscopy , infrared spectroscopy , glow discharge , polymerization , analytical chemistry (journal) , surface modification , plasma polymerization , polymer chemistry , chemical engineering , composite material , plasma , chemistry , polymer , organic chemistry , physics , quantum mechanics , engineering , metallurgy
The use of remote microwave plasma for the polymerization and deposition of tetraethoxysilane on the surface of polytetrafluoroethylene was investigated using a mixture of Argon and dinitrogen oxide as carrier gas. Layers with thicknesses of 0.5–3 μm were obtained, differing in chemical composition, surface energy, and flexibility/brittleness, depending on the plasma power and both the treatment and aging times. In general, milder treatments and shorter aging times resulted in higher contents of organic structural elements in the layers and greater flexibility and surface energy. Anchoring between the layers and the bulk polytetrafluoroethylene was at least partially caused by fibrils interconnecting the two components. These results were obtained by X‐ray photoelectron spectroscopy, Fourier transform infrared spectroscopy in the attenuated total reflection mode, contact angle measurements, and scanning electron microscopy combined with energy dispersive X‐ray analysis. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 76: 1207–1216, 2000