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Thermal degradation of LC epoxy thermosets
Author(s) -
Lu M. G.,
Shim M. J.,
Kim S. W.
Publication year - 2000
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(20000321)75:12<1514::aid-app10>3.0.co;2-e
Subject(s) - epoxy , thermosetting polymer , degradation (telecommunications) , materials science , composite material , thermal , computer science , physics , telecommunications , meteorology
A novel liquid crystalline (LC) epoxy monomer was cured with different types of hardeners. The thermal‐degradation properties of cured thermosets were evaluated by thermogravimetric (TG) analysis. Several widely used kinetic models were reviewed and used to fit the TG data. The experimental results showed that the methods from one constant heating rate are insensitive to the magnitude of reaction order n . The Kissinger and Osawa methods from multiple processes would give more confident kinetic parameters in these observed systems. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 75: 1514–1521, 2000