Premium
Characterization, properties, and processing of LaRC PETI‐5 as a high‐temperature sizing material. II. Thermal characterization
Author(s) -
Cho Donghwan,
Drzal Lawrence T.
Publication year - 2000
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(20000307)75:10<1278::aid-app9>3.0.co;2-m
Subject(s) - thermogravimetric analysis , differential scanning calorimetry , isothermal process , materials science , thermal stability , composite material , fourier transform infrared spectroscopy , glass transition , thermosetting polymer , polymer chemistry , polymer , chemical engineering , chemistry , thermodynamics , organic chemistry , physics , engineering
In this publication the glass transition, melting behavior, cure behavior, and thermal stability of LaRC PETI‐5 have been extensively studied utilizing differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The material used here was subjected to different thermal history (cumulative cure and individual cure) including an isothermal cure. The extent of cure for the partially cured resin was evaluated taking into account the residual solvent in the resin with the aid of a correction factor. The data show that the thermal history for the imidization reaction may influence the extent of cure for the partially cured LaRC PETI‐5. The reaction of the CC bonds in the phenylethynyl groups located in the imide polymer chain ends is completed to produce a fully cured LaRC PETI‐5 within 1 h at 350°C in air. The result is very consistent with the result obtained using Fourier Transform infrared (FT‐IR) spectroscopy in the previous work. This study also demonstrates that no reaction takes place above 350°C prior to degradation. LaRC PETI‐5 with a molecular weight of 2500 g/mol has excellent thermal stability up to 550°C as long as it is fully imidized. The result of the isothermal stability suggests that this material may be used without significant loss of its integrity for extended periods of time below 450°C. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 75: 1278–1287, 2000