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Interdependence between the curing, structure, and the mechanical properties of phenolic resins
Author(s) -
Wolfrum J.,
Ehrenstein G. W.
Publication year - 1999
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19991220)74:13<3173::aid-app21>3.0.co;2-6
Subject(s) - curing (chemistry) , materials science , composite material , scanning electron microscope , ultimate tensile strength , microstructure , void (composites) , dynamic mechanical analysis , polymer
The interdependence between the curing conditions, structure, and the mechanical properties of tow neat phenolic resin systems was investigated. Changes of the distribution of the void diameters were characterized by light‐ an scanning electron microscope analyses. Tensile tests and dynamic mechanical thermo analysis were performed to determine the influence of the hardener concentration and the curing temperature on the mechanical and the thermomechanical properties. The study reveals that the hardener concentration predominately influenced the microscopic structure, and thus the mechanical properties of the phenolic resin systems. By varying the postcuring times, it can be shown that independent from the microstructure of the phenolic resin system, the degree of cure has a strong influence on the mechanical properties. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 3173–3185, 1999