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Durability of isocyanate resin adhesives for wood. II. Effect of the addition of several polyols on the thermal properties
Author(s) -
Umemura Kenji,
Takahashi Akihiro,
Kawai Shuichi
Publication year - 1999
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19991114)74:7<1807::aid-app24>3.0.co;2-0
Subject(s) - polyol , thermal stability , pentaerythritol , isocyanate , adhesive , bond strength , materials science , polymer chemistry , composite material , polyurethane , chemistry , organic chemistry , fire retardant , layer (electronics)
The thermal properties of isocyanate (IC) resins prepared with a small amount of polyether polyols and water were investigated using dynamic mechanical analysis (DMA). The bond strengths of 3‐ply plywoods glued with these polyol‐containing IC resins were also measured. The thermal stability was dramatically improved by addition of dipropylene glycol‐type polyols with molecular weights of 400 and 1000. In addition, the bond strengths in a dry condition and after aging at 250°C for 10 min exhibited high values compared with that of an IC resin cured with water alone. However, addition of the same polyol type with a molecular weight of 3000 resulted in low heat stability and low bond strength. In the case of glycerin‐type polyol with a molecular weight of 400, good thermal stability and slightly higher bond strength were obtained. When bisphenol A and pentaerythritol‐type polyols were used, not much improvement in thermal stability was achieved. The bond strengths were similar or inferior to that of an IC resin cured with water only. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 1807–1814, 1999