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Polydimethylsiloxane containing isocyanate group‐modified epoxy resin: Curing, characterization, and properties
Author(s) -
Shih WenChang,
Ma ChenChi M.,
Yang JenChang,
Chen HungDe
Publication year - 1999
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19990923)73:13<2739::aid-app22>3.0.co;2-f
Subject(s) - isocyanate , epoxy , curing (chemistry) , materials science , glass transition , flexural strength , composite material , flexural modulus , polydimethylsiloxane , dynamic mechanical analysis , composite number , methylene , polymer chemistry , polyurethane , chemistry , organic chemistry , polymer
A synthesized polydimethylsiloxane containing an isocyanate group was used to improve the flexibility and to reduce the internal stress of epoxy resin cured with MDA (4,4′‐methylene dianiline). The effect of polysiloxane content on the curing kinetics of a novolac‐type epoxy modified with an isocyanate group was investigated. It was found that the modified epoxy resin showed significant improvement in impact strength. The polysiloxane containing isocyanate groups effectively depressed the internal stress of cured epoxy resins by reducing the flexural modulus and the coefficient of thermal expansion, while the glass transition temperature was increased. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 2739–2747, 1999