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Measurements of interfacial strength from the blister test
Author(s) -
Wang Chi
Publication year - 1999
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19990906)73:10<1899::aid-app9>3.0.co;2-w
Subject(s) - composite material , materials science , quasistatic process , ultimate tensile strength , deformation (meteorology) , fracture mechanics , fracture (geology) , radius , adhesive , elastic modulus , strain energy release rate , modulus , thermodynamics , physics , computer security , layer (electronics) , computer science
Abstract Measurements of the interfacial properties between an elastic tape and poly(methyl methylcrylate) substrates were carried out using a circular blister test. All properties, including adhesive fracture energy G a , residual stress ς o and the elastic modulus of the tapes can be deduced in a single test. Three different approaches have been adopted to analyze the relations between blister radius, blister height, and the pressure inside the blister. A comparison of the calculated results from these methods is provided and the details of the fracture process are discussed. Effect of the volume flowrate of the injected fluid was investigated as well. Results show that the deduced value of G a is about 3.0 ± 0.5 J/m 2 and the elastic modulus of tape is 330 ± 40 MPa, in good agreement with that determined from the tensile test. The fracture time is reduced from 4000 to 700 s for a flowrate of the injected fluid from 0.05 to 0.5 mL/h. In all cases, quasistatic deformation of the blister is found valid and the effect of the flowrates on the failure mechanics is not significant for the present study. However, one should take the dynamic deformation effect of the blister into consideration when the flowrate is too high. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 1899–1912, 1999