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Kinetics of 4,4′‐diaminodiphenylmethane curing of bisphenol‐S epoxy resin
Author(s) -
Li Yanfang,
Shen Shigang,
Liu Yanfang,
Gao Jungang
Publication year - 1999
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19990829)73:9<1799::aid-app23>3.0.co;2-y
Subject(s) - epoxy , curing (chemistry) , bisphenol a , differential scanning calorimetry , autocatalysis , kinetics , reaction rate constant , materials science , activation energy , order of reaction , polymer chemistry , composite material , chemistry , thermodynamics , physics , quantum mechanics
The kinetics of the cure reaction for a system of bisphenol‐S epoxy resin (BPSER), with 4,4′‐diaminodiphenylmethane (DDM) as a curing agent, were studied by means of differential scanning calorimetry (DSC). Analysis of DSC data indicated that an autocatalytic behavior showed in the first stages of the cure, with the model proposed by Kamal, which includes two rate constants, k 1 and k 2 , and two reaction orders, m and n . Rate constants k 1 and k 2 were observed to be greater when curing temperature increased. The over‐all reaction order, m + n , is in the range of 2.5 ∼ 3. The activation energies for k 1 and k 2 were 55 kJ/mol and 57 kJ/mol, respectively. Diffusion control is incorporated to describe the cure in the latter stages. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 1799–1803, 1999