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Improved adhesion between Kapton film and copper metal by silane‐coupling reactions
Author(s) -
Inagaki N.,
Tasaka S.,
Onodera A.
Publication year - 1999
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19990829)73:9<1645::aid-app5>3.0.co;2-l
Subject(s) - kapton , materials science , copper , imidazole , adhesion , silane , metal , polymer chemistry , x ray photoelectron spectroscopy , layer (electronics) , composite material , analytical chemistry (journal) , chemical engineering , polyimide , chemistry , metallurgy , organic chemistry , engineering
Kapton film, poly[( N , N ′‐oxydiphenylene)pyromellitimide], was modified by silane‐coupling reactions using 3′(trimethoxysilyl)propoxy‐2‐hydroxypro‐pyl‐1,3‐diazole (Si–imidazole) to improve the adhesion with copper metal. The Kapton film surface was first treated with argon plasma for 30 s, then dipped into a methanol solution of Si–imidazole (0.01 wt %), followed by heating at 110°C for 90 min. The Kapton surfaces, modified by the argon plasma and Si–imizadole coupling reactions, were analyzed by water contact‐angle measurement, atomic force microscopy, and XPS. The Si–imidazole modification showed a large increase in adhesion between the copper metal and the Kapton film. The peel strength of the copper metal/Kapton film joint increased from 0.94 to 2.4 N/5 mm. The failure occurred at the interface between the Si–imidazole and the Kapton film layer. We conclude that the Si–imidazole modification is an effective treatment for improvement of the adhesion between copper metal and Kapton film. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 1645–1654, 1999