Premium
Synthesis, characterization, thermal and flame‐retardant properties of silicon‐based epoxy resins
Author(s) -
Hsiue GingHo,
Wang WuJing,
ChangSupSup FengChih
Publication year - 1999
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19990815)73:7<1231::aid-app17>3.0.co;2-u
Subject(s) - epoxy , char , curing (chemistry) , fire retardant , limiting oxygen index , silicon , materials science , silane , polymer chemistry , monomer , chemical engineering , composite material , organic chemistry , chemistry , polymer , pyrolysis , engineering , metallurgy
A new silicon‐containing oxirane triglycidyl phenyl silane oxide (TGPSO) and its corresponding silicon‐containing epoxy resins are synthesized and characterized. The activation energies of TGPSO curing reaction with various curing agents, including 4,4‐diaminodiphenylmethane, 4,4‐diaminodiphenylsulfone, and dicyanodiaminde, are found to be 180, 196.5, and 154 kJ/mol. The curing reaction of TGPSO with diamines is determined to be a first‐order reaction through means of Arrhenius plots. The introduction of the silicon‐containing group results in higher curing reactivity. This silicon‐containing resin possesses higher char yield as well as higher limiting oxygen index (LOI = 35) than the commercial epoxy resins, confirming the usefulness of these silicon‐containing epoxy resins as flame retardants. Char yields and LOI measurements demonstrate that incorporating silicon into epoxy resins is able to improve their flame retardancy. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 1231–1238, 1999