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A conducting composite of polypyrrole with ultrahigh molecular weight polyethylene foam
Author(s) -
Aydinli B.,
Toppare L.,
Tinçer T.
Publication year - 1999
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19990628)72:14<1843::aid-app6>3.0.co;2-l
Subject(s) - materials science , composite material , polypyrrole , compression molding , polymerization , ultimate tensile strength , composite number , polymer , polyethylene , conductive polymer , molding (decorative) , polymer chemistry , mold
Through a chemical polymerization of pyrrole inside ultrahigh molecular weight polyethylene (UHMWPE) foam, a conducting polymer composite was obtained. To produce conductive polymer foams, successive imbibiting of reactives, FeCl 3 and pyrrole in tetrahydrofuran solutions, were carried out. The conductive polymeric materials were characterized by FTIR, DSC, and SEM. Mechanical property measurements were carried out on the films prepared by the compression molding of the conductive foam polymers. These films showed rather high tensile strength compared to pure UHMWPE. Conductivity determined by a two‐probe technique showed that it increased with the pyrrole content in the UHMWPE foam matrix. The compression molding, however, resulted in a considerable reduction in the conductivities. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 72: 1843–1850, 1999