Premium
Effect of a tie layer on the delamination toughness of polypropylene and polyamide‐66 microlayers
Author(s) -
Ebeling T.,
Norek S.,
Hasan A.,
Hiltner A.,
Baer E.
Publication year - 1999
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19990228)71:9<1461::aid-app11>3.0.co;2-0
Subject(s) - polyamide , polypropylene , delamination (geology) , materials science , toughness , composite material , layer (electronics) , polymer science , geology , paleontology , subduction , tectonics
The effect of a thin tie layer on the adhesion of polypropylene (PP) and polyamide‐66 (PA) was studied by delamination of microlayers. The microlayers consisted of many alternating layers of PP and PA separated by a thin layer of a maleated PP. The peel toughness and delamination failure mode were determined using the T‐peel test. Without a tie layer, there was no adhesion between PP and PA. A tie layer with 0.2% MA provided some adhesion; however, delamination occurred by interfacial failure. Increasing the maleic anhydride (MA) content of the tie layer increased the interfacial toughness. With 0.5% MA, the interfacial toughness exceeded the craze condition of PP, and a transition from interfacial delamination to craze delamination occurred. Crazing ahead of the crack tip effectively reduced the stress concentration at the interface and dramatically increased the delamination toughness. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 71: 1461–1467, 1999