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Kinetic approach for epoxy resins cured with diaminodiphenyl sulfone under non‐isothermal conditions
Author(s) -
Cheng KuoChung,
Lia K. C.,
Chiu WenYen
Publication year - 1999
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19990131)71:5<721::aid-app6>3.0.co;2-z
Subject(s) - diglycidyl ether , epoxy , sulfone , isothermal process , curing (chemistry) , differential scanning calorimetry , materials science , polymer chemistry , bisphenol a , activation energy , kinetic energy , gel permeation chromatography , ether , polymer , composite material , thermodynamics , chemistry , organic chemistry , physics , quantum mechanics
The curing reactions of epoxy resin basing on diglycidyl ether bisphenol A (DGEBA) with 4,4′‐diaminodiphenyl sulfone (DDS) were investigated with a differential scanning calorimeter and gel permeation chromatography. Based on the generating function method and the Monte Carlo simulation procedure, kinetic models for both isothermal and nonisothermal curing conditions were proposed. The apparent activation energy of curing reactions was found to be 14.9 Kcal/mol by the thermal analysis. According to our kinetic models, gel points, the profiles of epoxy conversion, and the molecular weights of polymers were calculated. Good agreement is obtained between the model predictions and experimental data. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 71: 721–728, 1999