Premium
Atmospheric pressure plasma treatment of polyethylene via a pulse dielectric barrier discharge: Comparison using various gas compositions versus corona discharge in air
Author(s) -
Lynch John B.,
Spence Paul D.,
Baker David E.,
Postlethwaite Timothy A.
Publication year - 1999
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19990110)71:2<319::aid-app16>3.0.co;2-t
Subject(s) - dielectric barrier discharge , atmospheric pressure , corona discharge , surface modification , wetting , materials science , analytical chemistry (journal) , atmospheric pressure plasma , partial discharge , polyethylene , polyolefin , plasma , dielectric , plasma cleaning , surface energy , composite material , chemistry , electrode , voltage , optoelectronics , chromatography , electrical engineering , oceanography , physics , quantum mechanics , engineering , layer (electronics) , geology
Modification of polyolefin surfaces is often necessary to achieve improved printability, lamination, etc. Although corona discharge and flame treatments can produce the higher surface energy needed for these applications, the properties of the resulting surfaces are not always optimal. Atmospheric pressure plasma is a surface modification technique that is similar to corona discharge treatment, but with more control, greater uniformity, and higher efficiency. Using an atmospheric pressure plasma unit with a dielectric barrier discharge generated using an asymmetric pulse voltage, the effects of different gases, powers, and linespeeds on polyethylene surface treatment were studied. Our results show that atmospheric pressure plasma can be used to achieve higher long‐term wettability, higher surface oxygen and nitrogen, and a greater range of surface chemistries with better robustness versus standard corona treatment. Atomic force microscopy results suggest significant differences in the mechanism of surface functionalization versus etching and ablation depending on the gases used. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 71: 319–331, 1999