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Relationship between structures of polyacrylonitrile (PAN)–copper gradient composite film and electrochemical‐reaction conditions
Author(s) -
Tang Jianguo,
Hu Keao,
Fu Shaohai,
Qi Hongjin,
Cui Wei,
Jia Zhishun,
Li Kai,
Pang Huankao,
Wang Fahe
Publication year - 1998
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19980808)69:6<1159::aid-app13>3.0.co;2-o
Subject(s) - polyacrylonitrile , electrochemistry , materials science , scanning electron microscope , composite number , differential scanning calorimetry , copper , phase (matter) , chemical engineering , composite material , polymer chemistry , electrode , chemistry , polymer , metallurgy , organic chemistry , physics , engineering , thermodynamics
In this article, the relationship between the morphological structure and electrochemical conditions, the crystal structure in the electrochemical deposited phase, and the thermal properties of polyacrylonitrile (PAN)–copper gradient composite films (GCF) were studied. The results showed that the morphology of the GCF depended very much on the electrochemical conditions used in the reactions. The percent area of the deposited phase on the cross section of the GCF decreases with increases of the predrying time of the solution coated on the cathode, the power voltage, and the temperature in the electrochemical reactor. According to the data of a differential scanning calorimeter and a scanning electronic microscope, PAN chains are physically crosslinked by a deposited phase. Under the electrochemical conditions used in this article, the components of PAN are not affected by the electrochemical reactions. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 69: 1159–1165, 1998