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Effect of structure of aromatic diamines on curing characteristics, thermal stability, and mechanical properties of epoxy resins. I
Author(s) -
Gupta Neeraj,
Varma I. K.
Publication year - 1998
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19980613)68:11<1759::aid-app6>3.0.co;2-i
Subject(s) - diglycidyl ether , curing (chemistry) , ether , epoxy , diamine , polymer chemistry , differential scanning calorimetry , glass transition , sulfone , bisphenol a , materials science , thermal stability , aryl , benzene , chemistry , alkyl , organic chemistry , polymer , composite material , physics , thermodynamics
The curing behavior of diglycidyl ether of bisphenol‐A (DGEBA) with aromatic diamines having aryl–ether, aryl–ether–carbonyl, and aryl–ether–sulfone linkages was studied using differential scanning calorimetry (DSC). Aromatic diaminessuch as 1,3‐bis(aminophenoxy)benzene (R), 1,4‐bis(aminophenoxy)benzene (H),2,2′‐bis[4‐(4‐aminophenoxy)phenyl]propane (B), 4,4′‐bis(4‐aminophenoxy)benzo‐phenone (P), and bis[4‐(4‐aminophenoxy)phenyl]sulfone (S) were synthesized and characterized in the laboratory. Curing of DGEBA was done using both stoichiometric and nonstoichiometric amounts of diamines and the reaction was monitored using DSC. The reactivity of the diamines depended on the structure. The presence of electron withdrawing groups, even though significantly apart from the reaction site, reduced the nucleophilicity. No significant change was observed in the activation energy for curing, which was around 56 ± 2 kJ/mol. The glass transition temperature of the epoxy network depended on the structure and was higher when diamines P and S were used in comparison to diamines R, H, and B. The cured resins were stable up to 300°C, and maximum char yield (i.e., 32% at 600°C) was obtained in DGEBA cured with diamine P. The room temperature mechanical properties only changed marginally with the structure of the diamines. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 68: 1759–1766, 1998