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Infrared spectroscopic study of SiO x film formation and decomposition of vinyl silane derivative by heat treatment. II. On copper surface
Author(s) -
Kim Hyuncheol,
Jang Jyongsik
Publication year - 1998
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19980502)68:5<785::aid-app10>3.0.co;2-q
Subject(s) - copper , materials science , copolymer , silane , fourier transform infrared spectroscopy , thermal decomposition , polymer chemistry , coating , infrared spectroscopy , thin film , chemical engineering , composite material , polymer , organic chemistry , chemistry , metallurgy , nanotechnology , engineering
The thermooxidative degradation and SiO x film‐formation mechanism of poly(vinylimidazole‐ co ‐vinyltrimethoxysilane) [poly(VI‐ co ‐VTS)] on copper was investigated with Fourier transform infrared reflection and absorption spectroscopy (FTIR‐RAS). The spectral differences of the copolymers with different coating thicknesses were compared. Thermal degradation of the copolymer was catalyzed by copper in the copolymer film as well as on the copper surface. This catalytic effect of copper was observed regardless of coating thickness. Copper in the copolymer film participated in Cu‐containing SiO x film formation during thermal degradation. In addition, the enhanced heat treatment causes the film defects in Cu‐containing SiO x film as a result of thermal decomposition. Copper corrosion proceeded through these film defects. However, in a thick‐coated sample, copper oxides were first formed through the crack in the barrier film as a result of the residual stress. Copper oxides in the film interacted with the SiO x film to form a Cu‐rich phase in the vicinity of film defects and cracks. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 68:785–792, 1998