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Metallization of photosensitive epoxy
Author(s) -
Lian Syhming,
Wang Tsunghsiung,
Hung Aina
Publication year - 1998
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19980228)67:9<1639::aid-app16>3.0.co;2-p
Subject(s) - epoxy , materials science , composite material , adhesion , copper , soldering , substrate (aquarium) , metal , metallurgy , oceanography , geology
The adhesion strength of various photosensitive epoxies with copper or FR4 substrate was measured by the stud pull testing method. The adhesion strength was around 35–60 kg/cm 2 for photosensitive epoxy/copper laminate and 60–105 kg/cm 2 for photosensitive epoxy/FR‐4 laminate. A high adhesion strength of metal/photosensitive epoxy can be obtained when the surface of photosensitive epoxy is subjected to 1 minute of microetching in the processes of metallization. Under such a processing condition, the adhesion strength of copper/photosensitive epoxy for Taiyo PVI‐500/SA‐50 can be as high as 145 kg/cm 2 , and the adhesion strength remained higher than 145 kg/cm 2 after the solder float test. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 67:1639–1645, 1998