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Thermal behavior of aliphatic–aromatic poly(ether‐amide)s
Author(s) -
García J. M.,
Álvarez J. C.,
De La Campa J. G.,
De Abajo J.
Publication year - 1998
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19980207)67:6<975::aid-app2>3.0.co;2-j
Subject(s) - thermogravimetric analysis , polyamide , thermal stability , ether , polymer chemistry , phenylene , materials science , isothermal process , amide , polymer , glass transition , chemistry , organic chemistry , thermodynamics , composite material , physics
The thermal properties of a set of experimental aliphatic–aromatic polyamides containing ether linkages were examined as a function of their chemical structure. Variations of the glass transition temperature ( T g ) and melting temperature ( T m ) could be correlated with the length of the aliphatic spacers and with the orientation of the phenylene rings. Polymers with a high concentration of p ‐oriented phenylene units showed a higher T g than those containing mainly m ‐oriented ones; T g values ranged from 110 to 155°C. Surprisingly, a negligible dependence of T g s on the nature of flexible spacers was observed. For all of the polymers, the thermal stability was virtually the same, about 440°C, when tested by dynamic thermogravimetric analysis (TGA). However, quite different levels of thermal stability were found by isothermal TGA analysis for polyamides with different flexible spacers. Moreover, the poly(ether‐amide)s described here compare fairly well with wholly aromatic polyamides when measured by dynamic TGA; but isothermal TGA measurements clearly demonstrated that they decompose faster than aromatic polyamides. Treatment of the TGA curves by the method of McCallum provided kinetic data that confirmed a better long‐term stability for poly(ether‐amide)s with a higher proportion of para ‐oriented phenylene rings. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 67:975–981, 1998