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Cure processing modeling and cure cycle simulation of epoxy‐terminated poly(phenylene ether ketone). IV. Cure cycle simulation
Author(s) -
Wang Qiang,
He Tianbai,
Xia Ping,
Chen Tianlu,
Huang Baotong
Publication year - 1997
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19971128)66:9<1751::aid-app13>3.0.co;2-y
Subject(s) - epoxy , materials science , curing (chemistry) , isothermal process , phenylene , ether , composite material , ketone , polymer chemistry , polymer , chemistry , thermodynamics , organic chemistry , physics
Abstract Epoxy‐terminated poly(phenylene ether ketone) (E‐PEK) developed in this Institute is a candidate matrix resin for polymer composites as structural materials. Cure cycles for this reaction system were simulated according to the previously established processing model. It is found that for the E‐PEK system, the curing process is best completed by a stepwise cure cycle comprising two isothermal processes at different temperatures, T 1 and T 2 . The cure cycles over a wide range of processing parameters simulated, based on the established processing model, indicate that the processing window is width‐adjustable. Analysis of the mechanical properties of the composite sheets showed that the simulated cure cycles are acceptable and reliable. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 66: 1751–1757, 1997