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Influence of rheological properties of adhesive polymer on strain energy release rate of mode II and adhesive shear strength
Author(s) -
Lim Won Woo,
Mizumachi Hiroshi
Publication year - 1997
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19971017)66:3<525::aid-app13>3.0.co;2-u
Subject(s) - adhesive , materials science , viscoelasticity , composite material , rheology , strain rate , shearing (physics) , epoxy , ultimate tensile strength , shear rate , stress relaxation , creep , layer (electronics)
It is well known that adhesive strength shows temperature and rate dependencies reflecting viscoelastic properties of an adhesive used. Specifically, a mechanical relaxation mechanism around the glass transition temperature ( T g ) has a strong effect on the adhesive strength, which involves deformation of the adhesive layer. In addition, it is very interesting to know how viscoelastic properties of the adhesive affect the value of strain energy release rate since deformation and failure of the adhesive occur at the measurement of strain energy release rate for adhesive joints. In this study, adhesive tensile strength and strain energy release rate ( G IIC ) in plain‐shearing mode were measured under a constant experimental condition using adhesives consisting of two types of epoxy resins; the influence of viscoelastic properties on these two values was investigated, and we discuss the relationship between the adhesive shear strength and G IIC . © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 66: 525–536, 1997