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Synthesis and properties of silicon‐containing polyamides
Author(s) -
Sava I.,
Bruma M.,
Schulz B.,
Mercer F.,
Reddy V. N.,
Belomoi.
Publication year - 1997
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19970822)65:8<1533::aid-app11>3.0.co;2-x
Subject(s) - polymer chemistry , condensation polymer , thermal stability , polyamide , materials science , thermal decomposition , glass transition , polymer , silicon , dielectric , dimethylformamide , chemical engineering , chemistry , organic chemistry , composite material , optoelectronics , solvent , engineering , metallurgy
A series of aromatic polyamides incorporating silicon together with phenylquinoxaline or with hexafluoroisopropylidene groups has been synthesized by solution polycondensation of a silicon‐containing diacid chloride with aromatic diamines having phenylquinoxaline rings or hexafluoroisopropylidene groups. These polymers are easily soluble in polar aprotic solvents, such as N ‐methylpyrrolidinone and dimethylformamide, and in tetrahydrofurane, and can be solution‐cast into thin, transparent films having low dielectric constant, in the range of 3.26 to 3.68. These polymers show high thermal stability with decomposition temperature being above 400°C and glass transition temperature in the range of 236°C to 275°C. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 65:1533–1538, 1997