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Bis(3‐aminophenyl)methyl phosphine oxide‐based (methyl) nadicimide resins
Author(s) -
Alam Sarfaraz,
Kandpal L.D.,
Varma I.K.
Publication year - 1997
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19970801)65:5<861::aid-app3>3.0.co;2-l
Subject(s) - pyromellitic dianhydride , polymer chemistry , benzophenone , acetic anhydride , phosphine oxide , acid anhydride , curing (chemistry) , oxide , acetic acid , chemistry , acetone , phthalic anhydride , nitrogen , nuclear chemistry , organic chemistry , materials science , polyimide , phosphine , epoxy , catalysis , layer (electronics)
Ten nadicimide/methyl nadicimide end‐capped oligomeric resins were prepared by reacting endo‐5‐norbornene‐2,3‐dicarboxylic acid anhydride (methyl nadic anhydride), pyromellitic dianhydride (PMDA)/3,3′,4,4′‐benzophenone tetracarboxylic acid dianhydride (BTDA)/2,2‐bis(3,4‐dicarboxyphenyl)hexafluoropropane dianhydride (6F), and bis(3‐aminophenyl) methyl phospine oxide (BAP) in glacial acetic acid/acetone. Structural characterization of the resins was done by elemental analysis, IR, and 1 H‐NMR. Multistep decomposition was observed in the TG scan of uncured resins in a nitrogen atmosphere. Residual weight at 800°C depended on the structure and ranged between 25 and 51%. Isothermal curing of the resins was done at 300°C for 1 h in an air atmosphere. These cured resins were stable to 350 ± 30°C and decomposed in a single step above this temperature. The char yield of the resins increased on curing and was in the range 34–70%. © 1997 John Wiley & Sons, Inc. J Appl Polm Sci 65:861–869, 1997