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Synthesis and characterization of photosensitive copolysiloxaneimides
Author(s) -
Zhu Pukun,
Li Zuobang,
Wang Qiang,
Feng Wei,
Wang Lixin
Publication year - 1997
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19970523)64:8<1463::aid-app2>3.0.co;2-f
Subject(s) - pyromellitic dianhydride , photosensitivity , thermal stability , materials science , polymer chemistry , monomer , benzophenone , glass transition , characterization (materials science) , chemical engineering , polyimide , composite material , polymer , nanotechnology , optoelectronics , layer (electronics) , engineering
Photosensitive copolysiloxaneimides were prepared by adding a photosensitive monomer such as hydroxyethylacrylate (HEA) to copolyisoimides, which were synthesized by the copolycondensation of pyromellitic dianhydride, benzophenone tetracarboxylic dianhydride with oxydianiline, and bis(p‐aminophenoxy) dimethylsiloxane. The forming process of isoimide rings caused by the reaction of polyamic acid with dicyclohexylcarbodiimide and the disappearance process of isoimide rings caused by the reaction of copolyisoimide with HEA were monitored in situ by infrared approach. A series of photosensitive copolysiloxaneimides films were prepared, and the desired structure‐properties relationships about inherent viscosities, thermal expansion coefficient, thermal stability and glass transition temperature, dielectric constants, moisture absorption, and photosensitivity were also discussed. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 64: 1463–1468, 1997