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Relationship between thermal properties and diffusion coefficients of gases for polyimide films
Author(s) -
Tsuzumi Hiroyuki,
Toi Keio,
Ito Tomoyasu,
Kasai Tetsuo
Publication year - 1997
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19970411)64:2<389::aid-app21>3.0.co;2-v
Subject(s) - polyimide , materials science , diffusion , thermal , composite material , thermodynamics , chemical engineering , polymer chemistry , polymer science , physics , layer (electronics) , engineering
The relationships between the chemical structure, packing density (1/ V F ), and cohesive energy density (CED) and the thermal properties of polyimides were investigated. Particularly, the correlation of tan δ measured by stress–strain/thermal mechanical analysis with 1/ V F and CED was found for eight polyimides. We measured the relationship between the apparent diffusion coefficient ( D a ) and 1/ V F and CED, respectively, as described in previous articles. From these experiments, we found that the thermal properties, especially tan δ, were correlated with the apparent diffusion coefficient of gas. These results are well explained by use of micro‐Brownian motion. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 64: 389–397, 1997