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New photoimageable dielectric insulating copolyester thin films: Synthesis and characterization
Author(s) -
Shi Frank F.,
Schneggenburger Lizabeth A.,
Economy James
Publication year - 1997
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19970228)63:9<1199::aid-app12>3.0.co;2-v
Subject(s) - copolyester , dielectric , materials science , curing (chemistry) , glass transition , thermal stability , composite material , polymer , polymer chemistry , thin film , dielectric loss , dielectric strength , chemical engineering , polyester , nanotechnology , optoelectronics , engineering
In this article, we describe the synthesis and characterization of a new family of photoimageable dielectric insulating polymer films. Four different photoimageable thin films have been prepared from all‐aromatic and aromatic/aliphatic copolyesters, which exhibit good photospeed (10–180 s, 15.5 mW/cm 2 intensity), resolution and line width (10 μm), thermal stability (330–400°C), adhesion on different substrates, mechanical strength, and reasonable glass transition temperature (120–150°C). One feature of the new photoimageable copolyester is the formation of a low dielectric constant film (2.5 at 1 kHz, 25°C) upon curing at temperatures up to 280°C. The low dielectric constant is a result of foaming arising from evolution of by‐products during curing. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 63: 1199–1211, 1997