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Effect of cure conditions on Probimide 32 polyamide‐imide
Author(s) -
Rich David C.,
Sichel Enid K.,
Cebe Peggy
Publication year - 1997
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19970228)63:9<1113::aid-app3>3.0.co;2-k
Subject(s) - thermogravimetric analysis , materials science , polyamide , differential scanning calorimetry , curing (chemistry) , thermal stability , imide , composite material , polymer , fourier transform infrared spectroscopy , polymer chemistry , solvent , chemical engineering , chemistry , organic chemistry , physics , engineering , thermodynamics
We report on a curing study of Probimide 32, a preimidized polyamide‐imide. The polymer was in a solution of N ‐methyl pyrrolidone (NMP) and xylene and was spun cast or doctor‐bladed to form films for study. The films were cured by drying under a variety of conditions to effect solvent removal. We characterized the effects of cure by thermogravimetric analysis, dynamic mechanical analysis, Fourier transform infrared spectroscopy, and differential scanning calorimetry. Index of refraction was measured by waveguide prism coupling. Although the polymer did not require postprocessing thermal closure of its imide group, the physiochemical makeup of the system, and consequently, the properties of the Probimide 32 films, were highly dependent upon the curing temperature and environment. The properties/thermal stability improved as residual solvent was driven from the films. In the films hard baked at 300°C, the extent of thermally induced crosslinking was substantially greater in air‐cured films than in nitrogen‐cured films. The crosslinking markedly affected the properties and relaxation behavior of the material. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 63: 1113–1126, 1997