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Effect of imidization temperature on the adhesion of polyimide on aluminum
Author(s) -
Jang Jyongsik,
Lee Jeung Hoon
Publication year - 1996
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19961003)62:1<199::aid-app23>3.0.co;2-#
Subject(s) - polyimide , adhesion , materials science , aluminium , composite material , polymer science , polymer chemistry , layer (electronics)
Peel strength and lap shear strength between aluminum and polyimide were measured at different imidization temperatures. Polyimide was synthesized from 3,3′,4,4′‐benzophe‐nonetetracarboxylic dianhydride (BTDA) and 4,4′‐diaminophenylether (ODA). The interfacial adhesion between polyimide and aluminum shows a maximum value at the imidization temperature of 320°C. To relate the intefacial adhesion strength with chemical interaction between polyimide and aluminum the Fourie, transform infrared spectroscopy (FTIR) ATR technique was used. In addition, morphological studies on the peeled surfaces were also carried out. © 1996 John Wiley & Sons, Inc.