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Epoxy—phenol—cardanol—formaldehyde systems: Thermogravimetry analysis and their carbon fiber composites
Author(s) -
Nieu Nguyen Huu,
Tan Ton That Minh,
Huong Nguyen Le
Publication year - 1996
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19960926)61:13<2259::aid-app3>3.0.co;2-b
Subject(s) - thermogravimetry , cardanol , epoxy , thermal stability , materials science , composite material , phenol , formaldehyde , fiber , scanning electron microscope , composite number , phenol formaldehyde resin , thermal analysis , chemical engineering , thermal , chemistry , organic chemistry , physics , meteorology , engineering
Systems consisting of epoxy resin and phenol‐cardanol‐formaldehyde (PCF) were prepared. The thermal characterization of the systems, investigated by thermogravimetry analysis, indicated that the increase of PCF content improves the thermal stability. Chemical resistance as well as mechanical properties of their carbon‐fiber composites were also determined. The matrix‐fiber interfacial study by scanning electron microscopy showed that the higher the PCF amounts in the system products, the better the interfacial bonding. © 1996 John Wiley & Sons, Inc.