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Amine‐terminated oligoimides for epoxy curing
Author(s) -
Patel H. S.,
Shah V. J.,
Mathur A. B.
Publication year - 1996
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19960912)61:11<2023::aid-app17>3.0.co;2-9
Subject(s) - epoxy , differential scanning calorimetry , curing (chemistry) , thermogravimetry , materials science , polymer chemistry , conductometry , ether , amine gas treating , diamine , composite material , chemistry , organic chemistry , inorganic chemistry , physics , thermodynamics
Oligoimides of N,N ′,‐4,4′‐bismaleimidodiphenyl ether (DDEBM) and 4,4′‐diaminodiphenylmethane (DDM) were prepared by the Michael addition reaction. The synthesized oligoimides (DDEBM–DDM) were characterized for their molecular structure by elemental analysis and IR spectroscopy. The number‐average molecular weight ( M n ) was determined by nonaqueous conductometric titration. Thermal characteristics were studied by thermogravimetry. Use of DDEBM–DDM oligomers as a curing agent for epoxy resin was studied by differential scanning calorimetry (DSC). The resin curing of the epoxy was monitored by the change in oxirane spectral band in the IR spectrum. Glass fiber reinforced composites of DDEBM–DDM‐epoxy were prepared and evaluated for their physical and chemical properties. © 1996 John Wiley & Sons, Inc.