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Dynamic mechanical analysis of the effect of water on glass bead–epoxy composites
Author(s) -
Wang JoYu,
Ploehn Harry J.
Publication year - 1996
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/(sici)1097-4628(19960110)59:2<345::aid-app19>3.0.co;2-v
Subject(s) - composite material , materials science , epoxy , adhesion , dynamic mechanical analysis , relaxation (psychology) , dissipation factor , silane , polymer , dielectric , psychology , social psychology , optoelectronics
Dynamic mechanical analysis (DMA) has been used to investigate the effect of water and glass bead surface treatment on the properties of glass bead–epoxy composites. By treating or not treating the glass beads with a silane coupling agent, we fabricated composites with ostensibly good or poor interfacial adhesion. SEM images of fracture surfaces and water uptake data confirmed this picture. We used dynamic mechanical tests to measure the material properties of dry and wet specimens. Temperature sweep tests of atmosphere‐conditioned specimens indicated that the value of the loss tangent at the temperature of the α‐α‐relaxation peak was most sensitive to interfacial adhesion. For wet specimens, the magnitude of an additional relaxation process, denoted as the ω‐relaxation, correlated strongly with water uptake and, indirectly, interfacial adhesion. Master curves constructed from frequency sweep tests also manifested differences among dry and wet specimens, but shift factor data suggested that these tests were more prone to complications due to water loss. Apparent activation energies of α‐ and β‐relaxation processes were statistically significant indicators of interfacial adhesion in dry and wet composites, respectively. © 1996 John Wiley & Sons, Inc.