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Slow heat rate increases yeast thermotolerance by maintaining plasma membrane integrity
Author(s) -
de Marañón Iñigo Martínez,
Chaudanson Nicolas,
Joly Nathalie,
Gervais Patrick
Publication year - 1999
Publication title -
biotechnology and bioengineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.136
H-Index - 189
eISSN - 1097-0290
pISSN - 0006-3592
DOI - 10.1002/(sici)1097-0290(19991020)65:2<176::aid-bit7>3.0.co;2-5
Subject(s) - membrane , yeast , intracellular , saccharomyces cerevisiae , biophysics , programmed cell death , thermal shock , hsf1 , cell membrane , microbiology and biotechnology , shock (circulatory) , heat shock , chemistry , membrane integrity , biology , heat shock protein , biochemistry , apoptosis , hsp70 , materials science , medicine , gene , composite material
Thermal resistance of Saccharomyces cerevisiae was found to be drastically dependent on the kinetics of heat perturbation. Yeasts were found to be more resistant to a plateau of 1 h at 50°C after a slope of temperature increase (slow and linear temperature increments) than after a shock (sudden temperature change). Thermotolerance was mainly acquired between 40–50°C during a heat slope, i.e., above the maximal temperature of growth. The death of the yeasts subjected to a heat shock might be related to the loss of membrane integrity: intracellular contents extrusion, i.e., membrane permeabilization, was found to precede cell death. However, the permeabilization did not precede cell death during a heat slope and, therefore, membrane permeabilization was a consequence rather than a cause of cell death. During a slow temperature increase, yeasts which remain viable may have time to adapt their plasma membrane and thus maintain membrane integrity. © 1999 John Wiley & Sons, Inc. Biotechnol Bioeng 65: 176–181, 1999.