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Numerical analysis of localization using a viscoplastic regularization: influence of stochastic material defects
Author(s) -
Gutiérrez M. A.,
De Borst R.
Publication year - 1999
Publication title -
international journal for numerical methods in engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.421
H-Index - 168
eISSN - 1097-0207
pISSN - 0029-5981
DOI - 10.1002/(sici)1097-0207(19990430)44:12<1823::aid-nme564>3.0.co;2-5
Subject(s) - viscoplasticity , regularization (linguistics) , softening , modulus , finite element method , reliability (semiconductor) , material properties , moduli , mathematics , structural engineering , materials science , computer science , engineering , constitutive equation , physics , geometry , composite material , thermodynamics , artificial intelligence , quantum mechanics , power (physics)
The finite element reliability method is applied to evaluate the effects of stochastic imperfections on the localization behaviour of elasto‐viscoplastic softening solids. Material properties as the Young's modulus, the softening modulus and the initial yield stress are considered to be random fields. Failure criteria are defined for the peak load and the dissipated energy. Likely configurations of imperfections which lead to failure are obtained and the nature and relative importance of the corresponding localization patterns are analyzed. Copyright © 1999 John Wiley & Sons, Ltd.