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Thermal and radiation chemical stabilities of some polymers after Cu(II) build‐up
Author(s) -
Siyam T,
Ashour A H,
Youssef H A
Publication year - 1999
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/(sici)1097-0126(199909)48:9<799::aid-pi157>3.0.co;2-j
Subject(s) - polymer , thermal stability , polyacrylic acid , crystallinity , polyacrylamide , materials science , polymer chemistry , acrylic acid , acrylate , copolymer , chemical stability , acrylamide , copper , chemical engineering , chemical structure , nuclear chemistry , chemistry , organic chemistry , composite material , engineering , metallurgy
The interaction of polyacrylic acid (PAA), polysodium acrylate (PAANa), polyacrylamide (PAM) and acrylic acid–acrylamide copolymer P(AM‐AA) with copper sulphate was studied to evaluate the thermal and radiation chemical stabilities of the resultant polymers which contained increasing quantities of Cu 2 + . It was found that the efficiency of the polymers toward Cu 2 + interaction, as determined by XRF, follows the order P(AM‐AA) > PAM > PAANa. PAA was inactive, and no Cu 2 + ions were detected. Generally, the results obtained from TGA and DSC reveal that there is an improvement in the thermal stability when Cu 2 + is incorporated into the polymer matrix, but the amount of Cu 2 + bound to the polymeric chains does not correlate with their relative thermal stability. The degree of crystallinity estimated by X‐ray diffraction also increases as Cu 2 + is incorporated into the polymer. In addition to the thermal stability, the radiation chemical stability of polymer with accumulated Cu 2 + was found to be very high, so that the percentage of Cu 2 + released from the crosslinked polymers was zero at radiation doses of up to 500 kGy. © 1999 Society of Chemical Industry