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Modification of two‐component bismaleimide resin by blending (meth)allyl compounds as third components
Author(s) -
Iijima Takao,
Yuasa Noriyuki,
Tomoi Masao
Publication year - 1999
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/(sici)1097-0126(199907)48:7<587::aid-pi194>3.0.co;2-2
Subject(s) - flexural strength , bisphenol a , materials science , ternary operation , glass transition , flexural modulus , composite material , dmba , chemistry , polymer , epoxy , carcinogenesis , biochemistry , computer science , gene , programming language
A two‐component bismaleimide resin composed of 4,4′‐bismaleimidediphenyl methane (BDM) and o , o ′‐diallyl bisphenol A (DBA) (Matrimid 5292 resin) was used as a parent bismaleimide resin. Modification of the parent bismaleimide resin was examined using several kinds of (meth)allyl compounds as the third component. The (meth)allyl compounds include triallyl isocyanurate (TAIC), o , o ′‐dimethallyl bisphenol A (DMBA) and trimethallyl isocyanurate (TMAIC). In the ternary BDM/DBA/TAIC blends, the fracture toughness K IC and flexural strength for the cured resins decreased with increasing TAIC content; thermal properties of the cured resins were not deteriorated. In the ternary BDM/DBA/DMBA blends, K IC and flexural modulus for the cured resins increased and their glass transition temperatures decreased with an increase in DMBA content. Flexural strength increased up to DMBA 70 eq% blend and then decreased. In the ternary blend of BDM/DBA/TMAIC (1.0/0.5/0.5), K IC for the blend increased 15%, with retention of flexural property and T g . In the ternary BDM/DMBA/TMAIC (1.0/0.5/0.5) blend, the cured resin had balanced properties and its K IC increased 50% compared to the cured Matrimid resin. © 1999 Society of Chemical Industry