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Preparation, solubility and thermal behaviour of new bismaleimides containing silicone linkages
Author(s) -
Hao Jianjun,
Wang Wenyun,
Jiang Bibiao,
Cai Xingxian,
Jiang Luxia
Publication year - 1999
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/(sici)1097-0126(199903)48:3<235::aid-pi146>3.0.co;2-0
Subject(s) - solubility , glass transition , silicone , thermal stability , materials science , curing (chemistry) , polymer chemistry , solvent , boiling point , boiling , fourier transform infrared spectroscopy , chemical engineering , organic chemistry , composite material , chemistry , polymer , engineering
A series of new bismaleimides containing silicone linkages havebeen prepared via Diels–Alder reaction of bismaleimidescontaining silicone and bisfurans containing silicone; theirmolecular structures have been characterized by FTIR, NMR andelemental analysis. The solubility of the prepared bismaleimides wastested in six types of solvent of different boiling point andpolarity, and their curing temperatures were determined by DSC. Thethermal‐oxidative stability of the cured networks wasinvestigated by TGA and their glass transition temperatures weremeasured by DSC, revealing that the bismaleimides are soluble in lowboiling point solvents and their curing temperatures are in the range206–285°C. The DSC and TGA traces of cured networks showthat the glass transition temperatures are in the range287–331°C and that these resins are stable up to353–384°C. © 1999 Society of Chemical Industry