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Optimization of etching parameters of a fluorinated polyimide using the RIBE technique
Author(s) -
Lucas Bruno,
Moussant Cyril,
Moliton André,
Zyss Joseph
Publication year - 1998
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/(sici)1097-0126(1998100)47:2<210::aid-pi52>3.0.co;2-d
Subject(s) - etching (microfabrication) , reactive ion etching , materials science , polyimide , ion , analytical chemistry (journal) , activation energy , current density , plasma etching , inert , engraving , composite material , chemistry , layer (electronics) , organic chemistry , physics , quantum mechanics
A parametric study of etching a new type of fluorinated polyimide (6FDA‐ODA) has been carried out. This kind of material was especially elaborated for plasma etching (reactive ion etching, RIE); its behaviour was tested with the reactive ion beam etching (RIBE) technique which uses an (O + ) reactive ion beam and allows independent control of the ion energy and current density of the beam. Etch rates were measured as a function of energy ( E ), current density ( J ) and incident angle (θ) of the beam with the sample normal. These rates were shown to present a maximum value (1000Åmin ‐1 ) for an energy flux of about 3Wcm ‐2 ( E =6keV and J =0·5mAcm ‐2 ) and decreased when θ increased. These results were then compared with etching rates obtained with chemically inert ions (Ar + ): in this case, etching rates were five times lower than those measured with O + ions. © 1998 Society of Chemical Industry