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Investigation of the Properties of Phthalocyanine Resin Containing Bismaleimide Groups
Author(s) -
Zhang Juhua,
Liu Xinhua,
Wen Huarong,
Xie Meili,
Cai Xingxian
Publication year - 1997
Publication title -
polymer international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.592
H-Index - 105
eISSN - 1097-0126
pISSN - 0959-8103
DOI - 10.1002/(sici)1097-0126(199704)42:4<363::aid-pi711>3.0.co;2-0
Subject(s) - materials science , monomer , polymerization , polymer chemistry , thermogravimetry , glass transition , adhesive , composite material , polymer , chemistry , inorganic chemistry , layer (electronics)
A bisphthalonitrile monomer containing bismaleimide groups was synthesized using 4,4′‐bismaleimidodiphenylmethane and 4‐aminophenoxyphthalonitrile. The structure of the monomer was confirmed by elemental analysis and IR spectroscopy. With this monomer, a phthalocyanine resin containing bismaleimide groups was obtained by catalytic thermal polymerization. The structure of the resin was confirmed by IR spectroscopy. The characteristic absorption peak of nitrile groups at 2200cm ‐1 disappeared in the IR spectra, showing that polymerization of monomer was complete. Thermogravimetry of the resin in air and N 2 was investigated; the results show that this resin has excellent thermal and thermo‐oxidative stabilities, and a high char yield in nitrogen (82·7%). In addition, a monomer solution in dimethylacetamide was flow‐coated on a glass strip to form a resin film. The adhesion between film and glass strip was firm, and the resin film had strong resistance to saturated alkali solution. A solubility test showed that the resin possessed good chemical inertness. Copper and aluminium strips were bonded using monomer solution. The single‐lap shear strength of samples was tested after curing. The results demonstrated that the adhesion between resin and copper strips was stronger than with aluminium strips. The resin can be used as a heat‐resistant adhesive. © of SCI.